Samsung and AMD expand strategic collaboration on next-generation AI memory solutions
Samsung and AMD have signed a Memorandum of Understanding to expand their strategic collaboration on AI memory and computing technologies. The partnership focuses on next-generation AI systems and advanced memory solutions.
Samsung Electronics has announced the signing of a Memorandum of Understanding (MOU) with AMD to broaden their strategic partnership focused on developing next-generation AI memory and computing technologies.
The signing ceremony took place at Samsung’s state-of-the-art chip manufacturing facility in Pyeongtaek, Korea, attended by AMD’s Chair and CEO, Dr. Lisa Su, and Samsung Electronics’ Vice Chairman & CEO, Young Hyun Jun.
“Samsung and AMD are both committed to advancing AI computing, and this agreement signifies the expanding scope of our collaboration,” stated Young Hyun Jun. “With industry-leading HBM4 and next-gen memory architectures, alongside cutting-edge foundry and advanced packaging, Samsung is uniquely equipped to provide unmatched turnkey capabilities that align with AMD’s evolving AI strategy.”
Dr. Lisa Su remarked, “Driving the next generation of AI infrastructure necessitates deep collaboration across the industry. We are excited to broaden our collaboration with Samsung, combining their prowess in advanced memory with our Instinct GPUs, EPYC CPUs, and rack-scale platforms. Full integration across the computing stack is crucial for accelerating AI innovation that delivers real-world impact at scale.”
Under this MOU, Samsung and AMD will coordinate on primary HBM4 supply for AMD’s next-generation AI accelerator, the AMD Instinct MI455X GPU, and advanced DRAM solutions for the 6th Gen AMD EPYC CPUs, codenamed “Venice.” These technologies are set to enhance next-gen AI systems integrating AMD Instinct GPUs, AMD EPYC CPUs, and rack-scale architectures like the AMD Helios platform.
The collaboration focuses on advanced memory technologies for AI and data center workloads, crucial as memory bandwidth and power efficiency become vital for system-level performance. This partnership aims to deliver more optimized AI infrastructure solutions for their customers.
Samsung’s HBM4, the first in the industry to enter mass production, is based on its advanced 6th-generation 10-nanometer-class DRAM process and a 4nm logic base die, offering processing speeds up to 13 gigabits-per-second and a maximum bandwidth of 3.3 terabytes-per-second, surpassing industry standards.
With Samsung HBM4’s leading performance, reliability, and energy efficiency, the AMD Instinct MI455X GPU is anticipated to be an optimal solution for high-performance systems tasked with AI model training and inference.
The MI455X GPU will be a critical component of the AMD Helios rack-scale architecture, designed to deliver the necessary performance and scalability for next-gen AI infrastructure.
In their collaboration, Samsung and AMD will also work together on high-performance DDR5 memory optimized for the 6th Gen AMD EPYC CPUs, aiming to provide industry-leading DDR5 memory solutions for systems built on the AMD Helios rack-scale architecture.
The companies will explore opportunities for a foundry partnership, where Samsung could offer foundry services for AMD’s future products.
Samsung and AMD have a long-standing collaboration spanning nearly two decades in graphics, mobile, and computing technologies, including Samsung’s role as the primary HBM3E partner to AMD, powering the latest AMD Instinct MI350X and MI355X AI accelerators.